Sensor pages

• Pixel sensor design
• Pixel test laboratory (Old version)

Test results

• Prototype-1 "S" First Batch
• Prototype-1 "S" Second Batch
• Tcheck Batch Prototype-1
• Prototype 1-A ("C"-vendor)
• Prototype 1-B ("I"-vendor)

Pictures

• A wafer under test
• Two tile sensors
• Microscope photograph (1000 x) of a biasing structure prot.1-A
• Picture drawing of tile-4 (prot. 1-B)
• Picture drawing of tile-5 (prot. 1-B)

Links

• MPI-Munich ATLAS pixel sensors
• Univ. of Dortmund ATLAS pixel sensor page
• University of New Mexico pixel sensor page
• University of Oklahoma pixel sensor page

The prototype sensors for the Atlas pixel detector have been purchased from two vendors: "C" and "S"

"C" wafers have been tested at HLL, MPI-Munich: here is a link to the "C" results .

"S" wafers have been tested in Udine, the results are shown in the following pages.

Two batches, each of 10 Silicon sensor wafers have been received in Udine so far. The first one was intended as a preliminary test. The wafers have been tested with a probe station for I-V characteristics and breakdown. Here is a photograph of a wafer under test. The measurements have been performed in a clean room, as additional photolithography steps will be required for bump-bonding. Single sided measurements were possible, due to the presence of a n+/n/n+ structure around each tile and each single chip. Tile2-type sensors have a punch-through structure at the n+ (pixelated) side, which allows a correct biasing also without bump-bonds connecting each individual pixel. This is not the case for Tile1 structures, where an atoll p-stop surrounds each pixel.

A complete list of the test structures present on the wafer is accessible with this link to Munich .

Here is a photograph of two tile sensors.